Sapphire NITRO+ RX 9070 XT

RX 9070

Last updated: September 14, 2025

Performance Overview

16.0
GB Memory
2970
MHz Boost
4.1K
Shader Cores
304
W TDP

Technical Specifications

Detailed technical specifications and performance characteristics

Basic Information

The Sapphire NITRO+ RX 9070 XT is a graphics processor manufactured by the manufacturer, designed as part of the RX 9070 series. Belonging to the nitro GPU category, it is optimized for nitro devices, offering reliable performance and efficiency for gaming and professional applications.

Sapphire NITRO+ RX 9070 XT
RX 9070
Nitro

Graphics Processor

The Sapphire NITRO+ RX 9070 XT features a sophisticated graphics processor built on the RDNA 4.0 architecture using a 4nm manufacturing process by TSMC with approximately 53900 million transistors. This advanced design enables efficient processing of complex graphics workloads and modern gaming features.

Navi 48
RDNA 4.0
4
53,900
151
357
TSMC

Memory

The Sapphire NITRO+ RX 9070 XT is equipped with 16GB GDDR6 video memory connected via a 256-bit memory interface providing 644.5999755859375GB/s of memory bandwidth. This memory configuration ensures smooth performance in high-resolution gaming and content creation tasks.

16,384
GDDR6
2,518
20.1
644.6
256

Render Configuration

The Sapphire NITRO+ RX 9070 XT features a powerful rendering engine with and 4096 shader cores, 128 render output units (ROPs), and 256 texture mapping units (TMUs). Additionally, it includes 64 dedicated ray tracing cores for advanced lighting effects. This comprehensive rendering configuration delivers excellent performance across a wide range of applications.

4,096
128
256
64

Clock Speeds

The Sapphire NITRO+ RX 9070 XT operates at a base clock speed of 1660MHz with the ability to boost up to 2970MHz under optimal conditions. This dynamic clock management ensures optimal performance while maintaining thermal efficiency.

1,660
2,970

Power Consumption

The Sapphire NITRO+ RX 9070 XT has a thermal design power (TDP) of 304 watts, indicating its power consumption characteristics and thermal requirements. This power profile makes it suitable for various system configurations and cooling solutions.

304