KUROUTOSHIKOU RX 7900 XT

RX 7900

Last updated: September 15, 2025

Performance Overview

20.0
GB Memory
2394
MHz Boost
5.4K
Shader Cores
300
W TDP

Technical Specifications

Detailed technical specifications and performance characteristics

Basic Information

The KUROUTOSHIKOU RX 7900 XT is a graphics processor manufactured by the manufacturer, designed as part of the RX 7900 series. Belonging to the desktop GPU category, it is optimized for desktop devices, offering reliable performance and efficiency for gaming and professional applications.

KUROUTOSHIKOU RX 7900 XT
RX 7900
Desktop

Graphics Processor

The KUROUTOSHIKOU RX 7900 XT features a sophisticated graphics processor built on the RDNA 3.0 architecture using a 5nm manufacturing process by TSMC with approximately 57700 million transistors. This advanced design enables efficient processing of complex graphics workloads and modern gaming features.

Navi 31
RDNA 3.0
5
57,700
109.1
529
TSMC

Memory

The KUROUTOSHIKOU RX 7900 XT is equipped with 20GB GDDR6 video memory connected via a 320-bit memory interface providing 800GB/s of memory bandwidth. This memory configuration ensures smooth performance in high-resolution gaming and content creation tasks.

20,480
GDDR6
2,500
20
800
320

Render Configuration

The KUROUTOSHIKOU RX 7900 XT features a powerful rendering engine with and 5376 shader cores, 192 render output units (ROPs), and 336 texture mapping units (TMUs). Additionally, it includes 84 dedicated ray tracing cores for advanced lighting effects. This comprehensive rendering configuration delivers excellent performance across a wide range of applications.

5,376
192
336
84

Clock Speeds

The KUROUTOSHIKOU RX 7900 XT operates at a base clock speed of 1387MHz with the ability to boost up to 2394MHz under optimal conditions. This dynamic clock management ensures optimal performance while maintaining thermal efficiency.

1,387
2,394

Power Consumption

The KUROUTOSHIKOU RX 7900 XT has a thermal design power (TDP) of 300 watts, indicating its power consumption characteristics and thermal requirements. This power profile makes it suitable for various system configurations and cooling solutions.

300