Inno3D GTX 1650 SUPER TWIN X2 OC

GTX 1650

Last updated: September 15, 2025

Performance Overview

4.0
GB Memory
1725
MHz Boost
1.3K
Shader Cores
100
W TDP

Technical Specifications

Detailed technical specifications and performance characteristics

Basic Information

The Inno3D GTX 1650 SUPER TWIN X2 OC is a graphics processor manufactured by the manufacturer, designed as part of the GTX 1650 series. Belonging to the desktop GPU category, it is optimized for desktop devices, offering reliable performance and efficiency for gaming and professional applications.

Inno3D GTX 1650 SUPER TWIN X2 OC
GTX 1650
Desktop

Graphics Processor

The Inno3D GTX 1650 SUPER TWIN X2 OC features a sophisticated graphics processor built on the Turing architecture using a 12nm manufacturing process by TSMC with approximately 6600 million transistors. This advanced design enables efficient processing of complex graphics workloads and modern gaming features.

TU116
Turing
12
6,600
23.2
284
TSMC

Memory

The Inno3D GTX 1650 SUPER TWIN X2 OC is equipped with 4GB GDDR6 video memory connected via a 128-bit memory interface providing 192GB/s of memory bandwidth. This memory configuration ensures smooth performance in high-resolution gaming and content creation tasks.

4,096
GDDR6
1,500
12
192
128

Render Configuration

The Inno3D GTX 1650 SUPER TWIN X2 OC features a powerful rendering engine with 20 compute units and 1280 shader cores, 32 render output units (ROPs), and 80 texture mapping units (TMUs). This comprehensive rendering configuration delivers excellent performance across a wide range of applications.

20
1,280
32
80

Clock Speeds

The Inno3D GTX 1650 SUPER TWIN X2 OC operates at a base clock speed of 1530MHz with the ability to boost up to 1725MHz under optimal conditions. This dynamic clock management ensures optimal performance while maintaining thermal efficiency.

1,530
1,725

Power Consumption

The Inno3D GTX 1650 SUPER TWIN X2 OC has a thermal design power (TDP) of 100 watts, indicating its power consumption characteristics and thermal requirements. This power profile makes it suitable for various system configurations and cooling solutions.

100