GIGABYTE GTX 680 WindForce 3X 4 GB

GTX 680

Last updated: September 15, 2025

Performance Overview

24.0
GB Memory
1058
MHz Boost
1.5K
Shader Cores
195
W TDP

Technical Specifications

Detailed technical specifications and performance characteristics

Basic Information

The GIGABYTE GTX 680 WindForce 3X 4 GB is a graphics processor manufactured by the manufacturer, designed as part of the GTX 680 series. Belonging to the windforce GPU category, it is optimized for windforce devices, offering reliable performance and efficiency for gaming and professional applications.

GIGABYTE GTX 680 WindForce 3X 4 GB
GTX 680
Windforce

Graphics Processor

The GIGABYTE GTX 680 WindForce 3X 4 GB features a sophisticated graphics processor built on the Kepler architecture using a 28nm manufacturing process by TSMC with approximately 3540 million transistors. This advanced design enables efficient processing of complex graphics workloads and modern gaming features.

GK104
Kepler
28
3,540
12
294
TSMC

Memory

The GIGABYTE GTX 680 WindForce 3X 4 GB is equipped with 24GB GDDR5 video memory connected via a 256-bit memory interface providing 192.3000030517578GB/s of memory bandwidth. This memory configuration ensures smooth performance in high-resolution gaming and content creation tasks.

24,576
GDDR5
1,502
6
192.3
256

Render Configuration

The GIGABYTE GTX 680 WindForce 3X 4 GB features a powerful rendering engine with and 1536 shader cores, 32 render output units (ROPs), and 128 texture mapping units (TMUs). This comprehensive rendering configuration delivers excellent performance across a wide range of applications.

1,536
32
128

Clock Speeds

The GIGABYTE GTX 680 WindForce 3X 4 GB operates at a base clock speed of 1006MHz with the ability to boost up to 1058MHz under optimal conditions. This dynamic clock management ensures optimal performance while maintaining thermal efficiency.

1,006
1,058

Power Consumption

The GIGABYTE GTX 680 WindForce 3X 4 GB has a thermal design power (TDP) of 195 watts, indicating its power consumption characteristics and thermal requirements. This power profile makes it suitable for various system configurations and cooling solutions.

195